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We have more Special DataSheet than other site. If, There is not a datasheet which searches, Request ! (It will updated in 12 hours.)
GetDatasheet is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 4369      Displaying: 3321 - 3340
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
3321.
2-2WI-1000S-161600 V, 1100 A, 8.8 kA water cooled A.C.switch
POSEI
-
2
-
-
108K
3322.
C460-XB290-E1000-A15.0mW; color:deep blue; 3.7-4.0V; Xbright InGaN LED
CREE
-
-
-
-
344K
3323.
C460-XB290-E1000-B14.0mW; color:blue; 3.7-4.0V; Xbright InGaN LED
CREE
-
-
-
-
344K
3324.
C470-XB290-E1000-A14.0mW; color:blue; 3.7-4.0V; Xbright InGaN LED
CREE
-
-
-
-
344K
3325.
C470-XB290-E1000-B14.0mW; color:blue; 3.7-4.0V; Xbright InGaN LED
CREE
-
-
-
-
344K
3326.
C505-XB290-E1000-A11.0mW; color:green; 3.8-4.0V; Xbright InGaN LED
CREE
-
-
-
-
344K
3327.
C505-XB290-E1000-B11.0mW; color:green; 3.8-4.0V; Xbright InGaN LED
CREE
-
-
-
-
344K
3328.
C527-XB290-E1000-A9.0mW; color:green; 3.8-4.0V; Xbright InGaN LED
CREE
-
-
-
-
344K
3329.
C527-XB290-E1000-B9.0mW; color:green; 3.8-4.0V; Xbright InGaN LED
CREE
-
-
-
-
344K
3330.
KBPC1000550 V, 10 A single-phase silicon bridge
HONEY
-
4
-55°C
125°C
215K
3331.
NTE5000AZener diode, 1/2 watt, + - 5 % tolerance. Nominal zener voltage Vz = 2.4V, Zener test current Izt = 20mA.
NTE
DO35
2
-65°C
200°C
26K
3332.
W4NRD0X-0000Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
3333.
W4NXD8C-0000Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
3334.
W4NXD8D-0000Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
3335.
W4NXD8G-0000Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
3336.
W6NXD0K-0000Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
3337.
W6NXD0KLSR-0000Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
3338.
W6NXD3J-0000Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
3339.
W6NXD3K-0000Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
3340.
W6NXD3L-0000Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
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