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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 101. | 5962P9960701QUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 102. | 5962P9960701QUX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 103. | 5962P9960701QUX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 104. | 5962P9960701QXX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 105. | 5962P9960702QUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 106. | 5962P9960702QUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 107. | 5962P9960702QUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 108. | 5962P9960702QXX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 109. | 5962P9960703QUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 110. | 5962P9960703QUX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 111. | 5962P9960703QXC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 112. | 5962P9960703QXC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 113. | 5962P9960703QXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 114. | 5962P9960704QUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 115. | 5962P9960704QUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 116. | 5962P9960704QUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 117. | 5962P9960704QXC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 118. | 5962P9960704QXC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 119. | 5962P9960704QXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 120. | 5962P9960704QXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
