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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 141. | UT22VP10C-20PPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 142. | UT22VP10C-20UPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 143. | UT22VP10C-20UPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 144. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 145. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 146. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 147. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 148. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 149. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 150. | UT22VP10C-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 151. | UT22VP10C-25PPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 152. | UT22VP10C-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 153. | UT22VP10C-25UPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 154. | UT22VP10C-25WPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 155. | UT22VP10C-25WPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 156. | UT22VP10E-15PPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 157. | UT22VP10E-15PPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 158. | UT22VP10E-15PPX | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 159. | UT22VP10E-15UPA | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 160. | UT22VP10E-15UPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
