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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 121. | UT22VP10E-15WPA | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 122. | UT22VP10E-15WPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 123. | UT22VP10E-15WPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 124. | UT22VP10E-15WPX | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 125. | UT22VP10E-20PPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 126. | UT22VP10E-20PPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 127. | UT22VP10E-20PPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 128. | UT22VP10E-20PPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 129. | UT22VP10E-20UPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 130. | UT22VP10E-20UPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 131. | UT22VP10E-20UPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | FlatPack | 24 | - | - | 287K |
| 132. | UT22VP10E-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 133. | UT22VP10E-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 134. | UT22VP10E-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 135. | UT22VP10E-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 136. | UT22VP10E-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 137. | UT22VP10E-25PPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 138. | UT22VP10E-25PPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 139. | UT22VP10E-25PPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 140. | UT22VP10E-25UPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | FlatPack | 24 | - | - | 287K |
