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Found: 162      Displaying: 81 - 100
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
81.
UT22VP10T-20PPXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
82.
UT22VP10T-20UPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
FlatPack
24
-
-
287K
83.
UT22VP10T-20UPXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional.
UTMC
FlatPack
24
-
-
287K
84.
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
85.
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
86.
UT22VP10T-20WPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
87.
UT22VP10T-20WPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
88.
UT22VP10T-20WPXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
89.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
90.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
91.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
92.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
93.
UT22VP10T-25PPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
94.
UT22VP10T-25UPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
FlatPack
24
-
-
287K
95.
UT22VP10T-25UPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
FlatPack
24
-
-
287K
96.
UT22VP10T-25WPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
97.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
98.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
99.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
100.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
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