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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 21. | UT22VP10E-20PCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 22. | UT22VP10E-20PCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 23. | UT22VP10E-20PCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 24. | UT22VP10E-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 25. | UT22VP10E-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 26. | UT22VP10E-25PCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 27. | UT22VP10E-25PCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 28. | UT22VP10E-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 29. | UT22VP10E-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 30. | UT22VP10E-25UCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 31. | UT22VP10E-25UCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 32. | UT22VP10E-25UCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 33. | UT22VP10E-25UCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 34. | UT22VP10E-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 35. | UT22VP10E-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 36. | UT22VP10E-25WCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 37. | UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 38. | UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 39. | UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 40. | UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 41. | UT22VP10E-25WPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 42. | UT22VP10E-25WPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
