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GetDatasheet is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 145      Displaying: 141 - 145
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
141.
5962F9475408QXXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
142.
5962F9475408QXXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
143.
5962F9475408QYARadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
144.
5962F9475408QYCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
145.
5962F9475408QYXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
146.
5962F9475408QYXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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