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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 21. | 5962F9475402QLA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 22. | 5962F9475402QLX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 23. | 5962F9475402QLX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 24. | 5962F9475402QXC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 25. | 5962F9475402QXC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 26. | 5962F9475402QXX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 27. | 5962F9475402QYA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 28. | 5962F9475402QYC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 29. | 5962F9475402QYX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 30. | 5962F9475402VXX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 31. | 5962F9475402VXX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 32. | 5962F9475402VYA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 33. | 5962F9475402VYC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 34. | 5962F9475402VYC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 35. | 5962F9475402VYX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 36. | 5962F9475402VYX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 37. | 5962F9475403QLC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 38. | 5962F9475403QLC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 39. | 5962F9475403QXA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish soldr. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 40. | 5962F9475403QXC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
