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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 41. | K4E641612B-TL50 | 4M x 16bit CMOS dynamic RAM with extended data out, 3.3V power supply, 50ns, low power | SMSNG | TSOP II | 50 | 0°C | 70°C | 885K |
| 42. | K4E641612C-TL50 | 4M x 16bit CMOS dynamic RAM with extended data out, 3.3V power supply, 50ns, low power | SMSNG | TSOP II | 50 | 0°C | 70°C | 884K |
| 43. | K4E661612B-TL50 | 4M x 16bit CMOS dynamic RAM with extended data out, 3.3V power supply, 50ns, low power | SMSNG | TSOP II | 50 | 0°C | 70°C | 885K |
| 44. | K4E661612C-TL50 | 4M x 16bit CMOS dynamic RAM with extended data out, 3.3V power supply, 50ns, low power | SMSNG | TSOP II | 50 | 0°C | 70°C | 884K |
| 45. | K4S641632F-TL50 | CMOS SDRAM 4 x 1,048,576 words by 16 bits, max freq. 200MHz, LVTTL interface | SMSNG | TSOP II | 54 | 0°C | 70°C | 133K |
| 46. | K4S643232E-TL50 | 512K x 32bit x 4 banks synchronous DRAM LVTTL, 3.3V, 200MHz | SMSNG | TSOP II | 86 | 0°C | 70°C | 102K |
| 47. | K4S643232F-TL50 | 512K x 32bit x 4 banks synchronous DRAM LVTTL, 3.3V, 200MHz | SMSNG | TSOP II | 86 | 0°C | 70°C | 101K |
| 48. | TL5001QDR | PULSE-WIDTH-MODULATION (PWM) CONTROL CIRCUIT | TI | D | 8 | -40°C | 125°C | 348K |
| 49. | TL500CDW | Analog-to-digital-converter building blocks | TI | SO | 20 | 0°C | 70°C | 787K |
| 50. | TL500CJ | Analog-to-digital-converter building blocks | TI | DIP | 18 | 0°C | 70°C | 787K |
| 51. | TL500CJ | Analog-to-digital-converter building blocks | TI | DIP | 18 | 0°C | 70°C | 787K |
| 52. | TL500IDW | Analog-to-digital-converter building blocks | TI | SO | 20 | -40°C | 85°C | 787K |
| 53. | TL500IDW | Analog-to-digital-converter building blocks | TI | SO | 20 | -40°C | 85°C | 787K |
| 54. | TL500IDW | Analog-to-digital-converter building blocks | TI | SO | 20 | -40°C | 85°C | 787K |
| 55. | TL501CDW | Analog-to-digital-converter building blocks | TI | SO | 20 | 0°C | 70°C | 787K |
| 56. | TL501CJ | Analog-to-digital-converter building blocks | TI | DIP | 18 | 0°C | 70°C | 787K |
| 57. | TL501IDW | Analog-to-digital-converter building blocks | TI | SO | 20 | -40°C | 85°C | 787K |
| 58. | TL501IJ | Analog-to-digital-converter building blocks | TI | DIP | 18 | -40°C | 85°C | 787K |
| 59. | TL502CN | Analog-to-digital-converter building blocks | TI | DIP | 20 | 0°C | 70°C | 787K |
| 60. | TL503CN | Analog-to-digital-converter building blocks | TI | DIP | 20 | 0°C | 70°C | 787K |
