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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1181. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1182. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1183. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1184. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1185. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1186. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1187. | UT22VP10C-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 1188. | UT22VP10C-25PPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 1189. | UT22VP10C-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 1190. | UT22VP10C-25UPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 1191. | UT22VP10C-25WPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1192. | UT22VP10C-25WPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1193. | UT22VP10E-15PPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 1194. | UT22VP10E-15PPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 1195. | UT22VP10E-15PPX | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 1196. | UT22VP10E-15UPA | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 1197. | UT22VP10E-15UPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 1198. | UT22VP10E-15WPA | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1199. | UT22VP10E-15WPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 1200. | UT22VP10E-15WPC | Radiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
