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Found: 1205      Displaying: 1121 - 1140
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1121.
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
1122.
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
1123.
UT22VP10T-20WPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
1124.
UT22VP10T-20WPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
1125.
UT22VP10T-20WPXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
1126.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1127.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1128.
UT22VP10T-25PCCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1129.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
1130.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
1131.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
1132.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
1133.
UT22VP10T-25PPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
1134.
UT22VP10T-25UPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
FlatPack
24
-
-
287K
1135.
UT22VP10T-25UPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
FlatPack
24
-
-
287K
1136.
UT22VP10T-25WPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
1137.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
1138.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
1139.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
1140.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
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