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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 41. | UT8Q512-20IPC | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish gold. Prototype flow. | UTMC | FlatPack | 36 | - | - | 127K |
| 42. | UT8Q512-20UCX | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish factory option. Military temperature range flow. | UTMC | FlatPack | 36 | -55°C | 125°C | 127K |
| 43. | UT8Q512-20UPC | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish gold. Prototype flow. | UTMC | Flatpack shielded | 36 | - | - | 127K |
| 44. | UT8Q512-IPC | 512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish gold. Prototype flow. | UTMC | FlatPack | 36 | - | - | 127K |
| 45. | UT8Q512-IPC | 512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish gold. Prototype flow. | UTMC | FlatPack | 36 | - | - | 127K |
| 46. | UT8Q512-UPC | 512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish gold. Prototype flow. | UTMC | Flatpack shielded | 36 | - | - | 127K |
| 47. | UT9Q512-20ICA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 128K |
| 48. | UT9Q512-20IWA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 128K |
| 49. | UT9Q512-20UCA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 128K |
| 50. | UT9Q512-20UWA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 128K |
| 51. | UT9Q512-ICA | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 128K |
| 52. | UT9Q512-ICC | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 128K |
| 53. | UT9Q512-IWA | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 128K |
| 54. | UT9Q512-IWC | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 128K |
| 55. | UT9Q512-UCC | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 128K |
| 56. | UT9Q512-UWA | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 128K |
| 57. | UT9Q512-UWA | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 128K |
| 58. | UT9Q512-UWC | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 128K |
| 59. | UT9Q512K32-SPC | 512K32 16Megabit SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. | UTMC | CQFP | 68 | - | - | 135K |
| 60. | UT9Q512K32-SPC | 512K32 16Megabit SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. | UTMC | CQFP | 68 | - | - | 135K |
