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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1641. | UT22VP10E-15UCA | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1642. | UT22VP10E-15UCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1643. | UT22VP10E-15UCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1644. | UT22VP10E-15UCX | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1645. | UT22VP10E-15WCA | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1646. | UT22VP10E-15WCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1647. | UT22VP10E-15WCX | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1648. | UT22VP10E-20PCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1649. | UT22VP10E-20PCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1650. | UT22VP10E-20PCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1651. | UT22VP10E-20UCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1652. | UT22VP10E-20UCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1653. | UT22VP10E-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1654. | UT22VP10E-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1655. | UT22VP10E-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1656. | UT22VP10E-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1657. | UT22VP10E-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1658. | UT22VP10E-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1659. | UT22VP10E-20WCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1660. | UT22VP10E-25PCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
