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Found: 1019      Displaying: 81 - 100
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
81.
5962H9651801QXCRadHard MSI: SMD. Quadruple 2-input AND gate. Class Q, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
82.
5962H9651801QXXRadHard MSI: SMD. Quadruple 2-input AND gate. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
83.
5962H9651901QXARadHard MSI: SMD. Quadruple 2-input AND gate. Class Q, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
84.
5962H9651901QXXRadHard MSI: SMD. Quadruple 2-input AND gate. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
85.
5962H9652001QCARadHard MSI: SMD. Triple 3-input NAND gates. Class Q, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
86.
5962H9652001QCCRadHard MSI: SMD. Triple 3-input NAND gates. Class Q, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
87.
5962H9652001QCXRadHard MSI: SMD. Triple 3-input NAND gates. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
88.
5962H9652001VCCRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
89.
5962H9652001VCCRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
90.
5962H9652001VCXRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
91.
5962H9652001VCXRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
92.
5962H9652101QCXRadHard MSI: SMD. Triple 3-input NAND gates. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
93.
5962H9652101VCARadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
94.
5962H9652101VCARadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
95.
5962H9652101VCXRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
96.
5962H9652101VCXRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
97.
5962H9652201QCXRadHard MSI: SMD. Triple 3-input AND gates. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
98.
5962H9652201QXARadHard MSI: SMD. Triple 3-input AND gates. Class Q, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
99.
5962H9652301QCARadHard MSI: SMD. Triple 3-input AND gates. Class Q, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
100.
5962H9652301QCCRadHard MSI: SMD. Triple 3-input AND gates. Class Q, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
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