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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 41. | 5962H3829435BNA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 42. | 5962H3829435BNA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 43. | 5962H3829435BNC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish gold. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 44. | 5962H3829435BNX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish optional. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 45. | 5962H3829435BXA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 46. | 5962H3829435BXC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish gold. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 47. | 5962H3829435BXX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish optional. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 48. | 5962H3829435SNA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish solder. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 49. | 5962H3829435SNC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish gold. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 50. | 5962H3829435SNX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish optional. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 51. | 5962H3829435SXA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish solder. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 52. | 5962H3829435SXC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish gold. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 53. | 5962H3829435SXX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish optional. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 54. | 5962H3829435SXX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish optional. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 55. | H3842P | High performance current mode controller | HSMC | DIP | 8 | -40°C | 150°C | 154K |
| 56. | H3842S | High performance current mode controller | HSMC | DIP | 8 | -40°C | 150°C | 155K |
| 57. | LG1600FXH3840 | Clock and data regenerator | AGERE | Surface-mount packag | 66 | 0°C | 70°C | 492K |
| 58. | RH5RH382B-T2 | PWM step-up DC/DC converter. Output voltage 3.8V. External Tr. driver (oscillator frequency 100kHz). Taping type T2 | RICOH | SOT-89 | 3 | -30°C | 80°C | 199K |
| 59. | RH5RH383B-T1 | PWM step-up DC/DC converter. Output voltage 3.8V. Internal Tr./External Tr. (selectively available) (oscillator frequency 100kHz, with chip enable function). Taping type T1 | RICOH | SOT-89 | 5 | -30°C | 80°C | 199K |
| 60. | RH5RH383B-T2 | PWM step-up DC/DC converter. Output voltage 3.8V. Internal Tr./External Tr. (selectively available) (oscillator frequency 100kHz, with chip enable function). Taping type T2 | RICOH | SOT-89 | 5 | -30°C | 80°C | 199K |
