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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 261. | ATF2500C-20JC | High-performance, high-density, electrically-erasable programmable logic device, 20ns | ATMEL | PLCC | 44 | 0°C | 70°C | 343K |
| 262. | ATF2500C-20PC | High-performance, high-density, electrically-erasable programmable logic device, 20ns | ATMEL | PDIP | 40 | 0°C | 70°C | 343K |
| 263. | ATF2500C-20PI | High-performance, high-density, electrically-erasable programmable logic device, 20ns | ATMEL | PDIP | 40 | -40°C | 85°C | 343K |
| 264. | UT22VP10C-20PCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 265. | UT22VP10C-20UCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 266. | UT22VP10C-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 267. | UT22VP10C-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 268. | UT22VP10C-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 269. | UT22VP10C-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 270. | UT22VP10C-20WCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 271. | UT22VP10C-20WCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 272. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 273. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 274. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 275. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 276. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 277. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 278. | WPS512K8C-20RJM | 512K x 8 SRAM, 20ns | WHITE | SOJ | 36 | -55°C | 125°C | 204K |
| 279. | WPS512K8C-20RJMB | 512K x 8 SRAM, 20ns | WHITE | SOJ | 36 | -55°C | 125°C | 204K |
| 280. | WPS512K8VC-20RJI | 3.3V 512K x 8 SRAM, 20ns | WHITE | SOJ | 36 | -40°C | 85°C | 194K |
| 281. | WPS512K8VC-20RJM | 3.3V 512K x 8 SRAM, 20ns | WHITE | SOJ | 36 | -55°C | 125°C | 194K |
