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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 421. | 5962D9960701TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 422. | 5962D9960701TUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 423. | 5962D9960701TXC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 424. | 5962D9960701TXX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 425. | 5962D9960702TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 426. | 5962D9960702TUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 427. | 5962D9960702TUX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 428. | 5962D9960702TUX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 429. | 5962D9960702TXC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 430. | 5962D9960703TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 431. | 5962D9960703TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 432. | 5962D9960703TUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 433. | 5962D9960703TXA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 434. | 5962D9960703TXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 435. | 5962D9960704TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 436. | 5962D9960704TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 437. | 5962D9960704TUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 438. | 5962D9960704TUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 439. | 5962D9960704TXC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 440. | 5962D9960704TXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
