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Found: 760      Displaying: 681 - 700
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
681.
5962R9475404QLARadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
682.
5962R9475404QLARadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
683.
5962R9475404QLCRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
684.
5962R9475404QLCRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
685.
5962R9475404QXARadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
686.
5962R9475404QXXRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
687.
5962R9475405QLARadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
688.
5962R9475405QLARadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
689.
5962R9475405QLCRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
690.
5962R9475405QLXRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
691.
5962R9475405QXARadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
692.
5962R9475405QXCRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
693.
5962R9475405QXCRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
694.
5962R9475405QXXRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
695.
5962R9475405QYARadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
696.
5962R9475405QYARadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
697.
5962R9475405QYCRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
698.
5962R9475405QYCRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
699.
5962R9475405VYARadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
700.
5962R9475405VYXRadiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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