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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 181. | 5962H3829435BNA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 182. | 5962H3829435BNA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 183. | 5962H3829435BNC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish gold. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 184. | 5962H3829435BNX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish optional. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 185. | 5962H3829435BXA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 186. | 5962H3829435BXC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish gold. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 187. | 5962H3829435BXX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish optional. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 188. | 5962H3829435SNA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish solder. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 189. | 5962H3829435SNC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish gold. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 190. | 5962H3829435SNX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish optional. | UTMC | FlatPack | 28 | -55°C | 125°C | 100K |
| 191. | 5962H3829435SXA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish solder. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 192. | 5962H3829435SXC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish gold. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 193. | 5962H3829435SXX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish optional. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 194. | 5962H3829435SXX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish optional. | UTMC | DIP | 28 | -55°C | 125°C | 100K |
| 195. | SDM9433 | 20V; 5.4A; dual P-channel enchancement mode MOSFET | SM | Surface mount | 8 | - | - | 378K |
| 196. | SDM9435A | 30V; 5.3A; 2.5W; dual enchanced mode field effect transistor (N and P - channel) | SM | Surface mount | 8 | -55°C | 150°C | 359K |
| 197. | SDU9435A | 30V; 10A; 2.5W; N-channel enchanced mode field effect transistor | SM | TO-252 | 3 | -55°C | 150°C | 396K |
| 198. | SMBJ5943B | 1.5W silicon surface mount zener diode. Zener voltage 56 V. Test current 6.7 mA. +-5% tolerance. | JGD | SMB/DO-214AA | 2 | -55°C | 200°C | 184K |
| 199. | SMBJ5943C | 1.5W silicon surface mount zener diode. Zener voltage 56 V. Test current 6.7 mA. +-2% tolerance. | JGD | SMB/DO-214AA | 2 | -55°C | 200°C | 184K |
| 200. | SMBJ5943D | 1.5W silicon surface mount zener diode. Zener voltage 56 V. Test current 6.7 mA. +-1% tolerance. | JGD | SMB/DO-214AA | 2 | -55°C | 200°C | 184K |
