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Found: 673      Displaying: 621 - 640
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
621.
5962H9658601QEARadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class Q, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
16
-55°C
125°C
10M
622.
5962H9658601QEARadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class Q, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
16
-55°C
125°C
10M
623.
5962H9658601QECRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class Q, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
16
-55°C
125°C
10M
624.
5962H9658601QECRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class Q, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
16
-55°C
125°C
10M
625.
5962H9658601QEXRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
16
-55°C
125°C
10M
626.
5962H9658601QXARadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class Q, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
16
-55°C
125°C
10M
627.
5962H9658601QXCRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class Q, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
16
-55°C
125°C
10M
628.
5962H9658601QXXRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
16
-55°C
125°C
10M
629.
5962H9658601VECRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
16
-55°C
125°C
10M
630.
5962H9658601VECRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
16
-55°C
125°C
10M
631.
5962H9658601VEXRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
16
-55°C
125°C
10M
632.
5962H9658601VXARadHard MSI: SMD. Hex buffer/line driver w/three-state output. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
16
-55°C
125°C
10M
633.
5962H9658601VXARadHard MSI: SMD. Hex buffer/line driver w/three-state output. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
16
-55°C
125°C
10M
634.
5962H9658601VXXRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
16
-55°C
125°C
10M
635.
5962H9658601VXXRadHard MSI: SMD. Hex buffer/line driver w/three-state outputs. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
16
-55°C
125°C
10M
636.
5962R9658601VXCRadHard MSI: SMD. Hex buffer/line driver w/three-state output. Class V, QML. Lead finish gold. Total dose 1E5 rads(Si).
UTMC
Ceramic flatpack
16
-55°C
125°C
10M
637.
5962R9658601VXCRadHard MSI: SMD. Hex buffer/line driver w/three-state output. Class V, QML. Lead finish gold. Total dose 1E5 rads(Si).
UTMC
Ceramic flatpack
16
-55°C
125°C
10M
638.
API860G3 V, 63 sec single chip high quality voice synthesizer IC
APLUS
DIP
28
0°C
70°C
481K
639.
LR38603Digital signal processor for color CCD cameras
SHARP
LQFP
80
-20°C
70°C
160K
640.
SB860D60 V, 8 A, D2PAK surface mount schottky barrier rectifier
TEL
D2PAK
4
-50°C
150°C
146K
641.
SB860F60 V, 8 A,isolation schottky barrier rectifier
TEL
TO-220AC
2
-50°C
150°C
147K
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