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Found: 854      Displaying: 821 - 840
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
821.
 5962D9960702QUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
822.
 5962D9960702QUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
823.
 5962D9960702QUX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
824.
 5962D9960702QXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
825.
 5962D9960702QXX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
826.
 5962D9960702TUX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
827.
 5962D9960702TUX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
828.
 5962L9960702TXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
829.
 5962L9960702TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
830.
 5962L9960702TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
831.
 5962P9960702QUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
832.
 5962P9960702QUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
833.
 5962P9960702QUC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
834.
 5962P9960702QXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 3E4(30krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
835.
 5962P9960702QXX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 3E4(30krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
836.
 5962P9960702TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
837.
 5962P9960702TUC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
838.
 5962P9960702TUX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
839.
 5962P9960702TXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
840.
 5962P9960702TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
841.
 5962P9960702TXX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
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