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Found: 1952      Displaying: 1861 - 1880
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1861.
5962H9475407VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1862.
5962H9475407VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1863.
5962H9475407VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1864.
5962H9475407VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1865.
5962H9475407VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1866.
5962H9475407VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1867.
5962H9475407VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1868.
5962H9475407VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1869.
5962H9475408QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1870.
5962H9475408QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1871.
5962H9475408VLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1872.
5962H9475408VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1873.
5962H9475408VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1874.
5962H9475408VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1875.
5962H9475408VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1876.
5962H9475408VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1877.
5962H9475408VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1878.
5962H9475408VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1879.
5962H9475408VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1880.
5962H9475408VYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1881.
5962H9475408VYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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