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Found: 1952      Displaying: 1841 - 1860
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1841.
 5962H9475406QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1842.
 5962H9475406QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1843.
 5962H9475406QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1844.
 5962H9475406QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1845.
 5962H9475406QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1846.
 5962H9475406QYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1847.
 5962H9475406QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1848.
 5962H9475406QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1849.
 5962H9475406VYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1850.
 5962H9475406VYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1851.
 5962H9475407QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1852.
 5962H9475407QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1853.
 5962H9475407QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1854.
 5962H9475407QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1855.
 5962H9475407QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1856.
 5962H9475407QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1857.
 5962H9475407QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1858.
 5962H9475407QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1859.
 5962H9475407VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1860.
 5962H9475407VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1861.
 5962H9475407VYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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