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Found: 1952      Displaying: 1721 - 1740
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1721.
 5962H9475401QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1722.
 5962H9475401QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1723.
 5962H9475401QLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1724.
 5962H9475401QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1725.
 5962H9475401QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1726.
 5962H9475401QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1727.
 5962H9475401QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1728.
 5962H9475401QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1729.
 5962H9475401QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1730.
 5962H9475401QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1731.
 5962H9475401QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1732.
 5962H9659401VRARadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1733.
 5962H9659401VRCRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1734.
 5962H9659401VRXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1735.
 5962H9659501VRARadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1736.
 5962H9659501VRCRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1737.
 5962H9659501VRCRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1738.
 5962H9659501VRXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1739.
 5962H9659501VRXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1740.
 5962H9659501VXXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
20
-55°C
125°C
10M
1741.
 5962H9659501VXXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
20
-55°C
125°C
10M
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