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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 401. | 5962G9475402QLA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 402. | 5962G9475402QLC | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 403. | 5962G9475402QLX | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 404. | 5962G9475402QXA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 405. | 5962G9475402QXA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 406. | 5962G9475403QLA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 407. | 5962G9475403QLA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 408. | 5962G9475403QLC | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 409. | 5962G9475403QLX | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 410. | 5962G9475403QXA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 411. | 5962G9475403QXA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 412. | 5962G9475403QXC | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 413. | 5962G9475403QXC | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 414. | 5962G9475403QXX | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 415. | 5962G9475403QYA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 416. | 5962G9475403QYC | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 417. | 5962G9475403VLA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 418. | 5962G9475403VLA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 419. | 5962G9475403VXX | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 420. | 5962G9475403VYC | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
