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Found: 475      Displaying: 341 - 360
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
341.
5962G9475405VLARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
342.
5962G9475405VLXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
343.
5962G9475405VLXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
344.
5962G9475406QXARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
345.
5962G9475406QXARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
346.
5962G9475406QXCRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
347.
5962G9475406QXCRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
348.
5962G9475406QXXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
349.
5962G9475406QXXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
350.
5962G9475406QYARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
351.
5962G9475406QYCRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
352.
5962G9475406QYXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
353.
5962G9475406VLARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
354.
5962G9475406VLCRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
355.
5962G9475406VXARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
356.
5962G9475406VXCRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
357.
5962G9475406VXXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
358.
5962G9475406VXXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
359.
5962G9475406VYARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
360.
5962G9475406VYARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
361.
5962G9475406VYCRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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