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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 341. | 5962L9960701TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 342. | 5962L9960701TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 343. | 5962L9960701TUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 344. | 5962L9960701TUX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 345. | 5962L9960702QXA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 346. | 5962L9960702TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 347. | 5962L9960702TUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 348. | 5962L9960702TUX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 349. | 5962L9960703TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 350. | 5962L9960703TUX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 351. | 5962L9960703TXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 352. | 5962L9960703TXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 353. | 5962L9960703TXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 354. | 5962L9960704QXA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 355. | 5962L9960704TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 356. | 5962L9960704TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 357. | 5962L9960704TUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 358. | 5962L9960704TUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 359. | 5962L9960704TUX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 360. | 5962L9960704TXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
