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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 281. | 5962D9960703QUX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 282. | 5962D9960704QUX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 283. | 5962D9960704QUX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 284. | 5962P9960701TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 285. | 5962P9960701TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 286. | 5962P9960701TUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 287. | 5962P9960701TXA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 288. | 5962P9960701TXC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 289. | 5962P9960702TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 290. | 5962P9960702TUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 291. | 5962P9960702TXA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 292. | 5962P9960702TXC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 293. | 5962P9960702TXX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 294. | 5962P9960703TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 295. | 5962P9960703TXC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 296. | 5962P9960704TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 297. | 5962P9960704TXA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 298. | 5962P9960704TXA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 299. | 5962P9960704TXC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 300. | 5962P9960704TXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
