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Found: 34      Displaying: 21 - 34
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
21.
UT22VP10C-25PPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
22.
UT22VP10C-25PPCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
23.
UT22VP10E-15PPCRadiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
24.
UT22VP10E-15PPCRadiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
25.
UT22VP10E-15PPXRadiation Hardened PAL. CMOS I/O: 15ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
26.
UT22VP10E-25PPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
27.
UT22VP10E-25PPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
28.
UT22VP10E-25PPCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
29.
UT22VP10E-25PPXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
30.
UT22VP10E-25PPXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
31.
UT22VP10T-15PPARadiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
32.
UT22VP10T-15PPCRadiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
33.
UT22VP10T-15PPXRadiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
34.
UT22VP10T-15PPXRadiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
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