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Found: 1332      Displaying: 1161 - 1180
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1161.
5962H9475401QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1162.
5962H9475401QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1163.
5962H9475401QLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1164.
5962H9475401QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1165.
5962H9475401QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1166.
5962H9475401QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1167.
5962H9475401QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1168.
5962H9475401QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1169.
5962H9475401QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1170.
5962H9475401QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1171.
5962H9475401QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1172.
5962H9475401VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1173.
5962H9475401VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1174.
5962H9475401VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1175.
5962H9475401VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1176.
5962H9475401VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1177.
5962H9475401VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1178.
5962H9475401VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1179.
5962H9475401VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1180.
5962H9475401VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1181.
5962H9659401VRARadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
20
-55°C
125°C
10M
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