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Found: 7464      Displaying: 6741 - 6760
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
6741.
5962G9475408QLARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
6742.
5962G9475408QLARadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
6743.
5962G9475408QLCRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
6744.
5962G9475408QLXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
6745.
5962G9475408QLXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
6746.
5962H9475408QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
6747.
5962H9475408QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
6748.
5962H9475408QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
6749.
5962H9475408QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
6750.
5962H9475408QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
6751.
5962H9475408QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
6752.
5962H9475408QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
6753.
5962H9475408QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
6754.
5962H9475408QYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
6755.
5962H9475408QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
6756.
5962H9475408QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
6757.
5962H9475408VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
6758.
5962H9475408VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
6759.
5962H9475408VYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
6760.
5962H9475408VYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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