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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 6701. | 5962H9475406QLA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 6702. | 5962H9475406QLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 6703. | 5962H9475406QXA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 6704. | 5962H9475406QXA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 6705. | 5962H9475406QXC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 6706. | 5962H9475406QYA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 6707. | 5962H9475406QYC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 6708. | 5962H9475406QYX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 6709. | 5962H9475406VLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 6710. | 5962H9475406VXA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 6711. | 5962H9475406VXC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 6712. | 5962H9475406VXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 6713. | 5962H9475406VXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 6714. | 5962H9475406VYA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 6715. | 5962H9475406VYC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 6716. | 5962H9475406VYX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 6717. | 5962H9475407QLA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 6718. | 5962H9475407QLA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 6719. | 5962H9475407QLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 6720. | 5962H9475407QXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
