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Found: 7464      Displaying: 2661 - 2680
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
2661.
 5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
2662.
 5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
2663.
 5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
2664.
 5962P0053601QUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
2665.
 5962P0053601QXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
2666.
 5962P0053601QXX512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
2667.
 5962P0053602QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
2668.
 5962P0053602QUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
2669.
 5962P0053602QXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
2670.
 5962P0053602QXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
2671.
 5962P0053603QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
2672.
 5962P0053603QUC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
2673.
 5962P0053603QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
2674.
 5962P0053603QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
2675.
 5962P0053604QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
2676.
 5962P0053604QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
2677.
 5962P0053604QUC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
2678.
 5962P0053604QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
2679.
 5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
2680.
 5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
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