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GetDatasheet is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 1299      Displaying: 781 - 800
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
781.
UT54ACS11PCARadHard MSI. Triple 3-input AND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
782.
UT54ACS11PCCRadHard MSI. Triple 3-input AND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
783.
UT54ACS11PCXRadHard MSI. Triple 3-input AND. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
784.
UT54ACS11UCARadHard MSI. Triple 3-input AND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
785.
UT54ACS11UCCRadHard MSI. Triple 3-input AND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
786.
UT54ACS14PCCRadHard MSI. Hex inverter with schmitt trigger. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
787.
UT54ACS14PCXRadHard MSI. Hex inverter with schmitt trigger. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
788.
UT54ACS14UCARadHard MSI. Hex inverter with schmitt trigger. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
789.
UT54ACTS10PCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
790.
UT54ACTS10PCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
791.
UT54ACTS10UCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
792.
UT54ACTS10UCCRadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
793.
UT54ACTS10UCCRadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
794.
UT54ACTS10UCXRadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
795.
UT54ACTS11PCARadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
796.
UT54ACTS11PCARadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
797.
UT54ACTS11PCXRadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
798.
UT54ACTS11PCXRadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
799.
UT54ACTS11UCARadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
800.
UT54ACTS11UCXRadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
801.
UT54ACTS11UCXRadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
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