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GetDatasheet is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 2591      Displaying: 2101 - 2120
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
2101.
UT54ACS27PCARadHard MSI. Triple 3-input NOR. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2102.
UT54ACS27PCCRadHard MSI. Triple 3-input NOR. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2103.
UT54ACS34PCARadHard MSI. Hex noninverting buffer. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2104.
UT54ACS34PCCRadHard MSI. Hex noninverting buffer. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2105.
UT54ACS34PCXRadHard MSI. Hex noninverting buffer. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2106.
UT54ACS34PCXRadHard MSI. Hex noninverting buffer. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2107.
UT54ACTS27PCARadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2108.
UT54ACTS27PCCRadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2109.
UT54ACTS27PCXRadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2110.
UT54ACTS27UCARadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2111.
UT54ACTS27UCCRadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2112.
UT54ACTS27UCCRadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2113.
UT54ACTS27UCXRadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2114.
UT54ACTS34PCARadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2115.
UT54ACTS34PCARadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2116.
UT54ACTS34PCCRadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2117.
UT54ACTS34PCCRadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2118.
UT54ACTS34PCXRadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2119.
UT54ACTS34UCARadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2120.
UT54ACTS34UCCRadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2121.
UT54ACTS34UCXRadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
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