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GetDatasheet is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 2591      Displaying: 2041 - 2060
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
2041.
UT54ACS08PCARadHard MSI. Quadruple 2-input AND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2042.
UT54ACS08PCARadHard MSI. Quadruple 2-input AND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2043.
UT54ACS08PCCRadHard MSI. Quadruple 2-input AND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2044.
UT54ACS08PCXRadHard MSI. Quadruple 2-input AND. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2045.
UT54ACS08UCARadHard MSI. Quadruple 2-input AND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2046.
UT54ACS08UCCRadHard MSI. Quadruple 2-input AND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2047.
UT54ACS08UCXRadHard MSI. Quadruple 2-input AND. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2048.
UT54ACS10PCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2049.
UT54ACS10PCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2050.
UT54ACS10PCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2051.
UT54ACS10PCXRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2052.
UT54ACS10UCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2053.
UT54ACS10UCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2054.
UT54ACS10UCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2055.
UT54ACS10UCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2056.
UT54ACS10UCXRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
2057.
UT54ACTS08PCARadHard MSI. Quadruple 2-input AND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2058.
UT54ACTS10PCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2059.
UT54ACTS10PCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
2060.
UT54ACTS10UCXRadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
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