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Found: 279      Displaying: 201 - 220
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
201.
5962H9475408QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
202.
5962H9475408QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
203.
5962H9475408QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
204.
5962H9475408QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
205.
5962H9475408QYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
206.
5962H9475408QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
207.
5962H9475408QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
208.
5962H9475408VLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
209.
5962H9475408VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
210.
5962H9475408VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
211.
5962H9475408VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
212.
5962H9475408VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
213.
5962H9475408VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
214.
5962H9475408VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
215.
5962H9475408VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
216.
5962H9475408VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
217.
5962H9475408VYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
218.
5962H9475408VYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
219.
UF5408Ultra fast rectifier. Max recurrent peak reverse voltage 1000 V. Max average forward rectified current 3.0 A.
JGD
-
2
-65°C
125°C
159K
220.
UF5408Ultra fast rectifier. Max recurrent peak reverse voltage 1000 V. Max average forward rectified current 3.0 A.
JGD
-
2
-65°C
125°C
159K
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