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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 541. | 5962R9475405VLA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 542. | 5962R9475405VLA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 543. | 5962R9475405VLC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 544. | 5962R9475405VXC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 545. | 5962R9475405VXC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 546. | 5962R9475406QLA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 547. | 5962R9475406QLX | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 548. | 5962R9475406QXA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 549. | 5962R9475406QXA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 550. | 5962R9475406QXC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 551. | 5962R9475406QXX | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 552. | 5962R9475406QYA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 553. | 5962R9475406QYC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 554. | 5962R9475406VLA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 555. | 5962R9475406VLC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 556. | 5962R9475406VLX | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 557. | 5962R9475406VXA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 558. | 5962R9475406VXC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 559. | 5962R9475406VXX | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 560. | 5962R9475406VYC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 561. | 5962R9475406VYX | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
