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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 381. | 5962F9475404QLA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 382. | 5962F9475404QLC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 383. | 5962F9475404QLC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 384. | 5962F9475404QLX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 385. | 5962F9475404QLX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 386. | 5962F9475404QXA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 387. | 5962F9475404QYX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 388. | 5962F9475405QLC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 389. | 5962F9475405QLX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 390. | 5962F9475405QXA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 391. | 5962F9475405QXC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 392. | 5962F9475405QXC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 393. | 5962F9475405QYC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 394. | 5962F9475405VLA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 395. | 5962F9475405VLA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 396. | 5962F9475405VXA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 397. | 5962F9475405VXA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 398. | 5962F9475405VXX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 399. | 5962F9475405VYA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 400. | 5962F9475405VYC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 401. | 5962F9475405VYX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
