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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1021. | 5962F9475404QLA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1022. | 5962F9475404QLC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1023. | 5962F9475404QLC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1024. | 5962F9475404QLX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1025. | 5962F9475404QLX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1026. | 5962F9475404QXA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1027. | 5962F9475404QYA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1028. | 5962F9475404QYC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1029. | 5962F9475404QYX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1030. | 5962F9475404VYA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1031. | 5962F9475404VYA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1032. | 5962F9475405QLC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1033. | 5962F9475405QLX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1034. | 5962F9475405QXA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1035. | 5962F9475405QXC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1036. | 5962F9475405QXC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 1037. | 5962F9475405QYC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1038. | 5962F9475405VYA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1039. | 5962F9475405VYC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 1040. | 5962F9475405VYX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
