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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 641. | 5962-9475807QYA | Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish solder. Class Q. Device type 07 (SuMMIT XTE 5V/15V). Radiation none. | UTMC | FlatPack | 140 | - | - | 47K |
| 642. | 5962-9475808QYA | Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish solder. Class Q. Device type 08 (SuMMIT XTE 5V/5V). Radiation none. | UTMC | FlatPack | 140 | - | - | 47K |
| 643. | 5962-9475809QYA | Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish solder. Class Q. Device type 09 (SuMMIT XTE 5V/12V). Radiation none. | UTMC | FlatPack | 140 | - | - | 47K |
| 644. | 5962-9475809QYA | Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish solder. Class Q. Device type 09 (SuMMIT XTE 5V/12V). Radiation none. | UTMC | FlatPack | 140 | - | - | 47K |
| 645. | 5962H9475401QLA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 646. | 5962H9475401QLA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 647. | 5962H9475401QLC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 648. | 5962H9475401QLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 649. | 5962H9475401QLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 650. | 5962H9475401QXA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 651. | 5962H9475401QXA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 652. | 5962H9475401QXC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 653. | 5962H9475401QXC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 654. | 5962H9475401QXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 655. | 5962H9475401QXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 656. | 5962H9475401VLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 657. | 5962H9475401VLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 658. | 5962H9475401VXA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 659. | 5962H9475401VXC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 660. | 5962H9475401VXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
