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GetDatasheet is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 2251      Displaying: 2121 - 2140
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
2121.
5962G9475402QLCRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
2122.
5962G9475402QLXRadiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
2123.
5962H9475402QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
2124.
5962H9475402QLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
2125.
5962H9475402QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
2126.
5962H9475402QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
2127.
5962H9475402QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
2128.
5962H9475402QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
2129.
5962H9475402QYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
2130.
5962H9475402QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
2131.
5962H9475402QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
2132.
5962H9475402VLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
2133.
5962H9475402VLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
2134.
5962H9475402VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
2135.
5962H9475402VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
2136.
5962H9475402VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
2137.
5962H9475402VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
2138.
5962H9475402VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
2139.
5962H9475402VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
2140.
5962H9475402VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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