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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1521. | 1N5374B | 75 V, 5 W, glass passivated junction silicon zener diode | TEL | DO-201AE | 2 | -55°C | 150°C | 267K |
| 1522. | 54FCT374AFMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | NSC | Flatpak | 20 | -55°C | 125°C | 213K |
| 1523. | 54FCT374ALMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | NSC | LCC | 20 | -55°C | 125°C | 213K |
| 1524. | 54FCT374APMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | NSC | Plastic DIP | 20 | -55°C | 125°C | 213K |
| 1525. | 54FCT374ASMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | NSC | SOIC | 20 | -55°C | 125°C | 213K |
| 1526. | 54FCT374ASMQB | Octal D flip-flop with TRI-STATE outputs. Military grade device with environmental and burn-in processing shipped in tubes. | NSC | SOIC | 20 | -55°C | 125°C | 213K |
| 1527. | MAX3748AETE | Compact 155Mbps to 3.2Gbps limiting amplifier | MAXIM | QFN | 16 | -40°C | 85°C | 414K |
| 1528. | MAX3748ETE | Compact 155Mbps to 3.2Gbps limiting amplifier | MAXIM | QFN | 16 | -40°C | 85°C | 414K |
| 1529. | SN54S374FK | Octal D-type transparent latches and edge-trigger flip-flop | TI | LCCC | 20 | -55°C | 125°C | 331K |
| 1530. | SN54S374J | Octal D-type transparent latches and edge-trigger flip-flop | TI | CERDIP | 20 | -55°C | 125°C | 331K |
| 1531. | SN54S374W | Octal D-type transparent latches and edge-trigger flip-flop | TI | FP | 20 | -55°C | 125°C | 331K |
| 1532. | UT54ACS374PCA | RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish solder. | UTMC | Ceramic DIP | 20 | -55°C | 125°C | 15K |
| 1533. | UT54ACS374PCA | RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish solder. | UTMC | Ceramic DIP | 20 | -55°C | 125°C | 15K |
| 1534. | UT54ACS374UCC | RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish gold. | UTMC | Ceramic flatpack | 20 | -55°C | 125°C | 15K |
| 1535. | UT54ACS374UCX | RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish optional. | UTMC | Ceramic flatpack | 20 | -55°C | 125°C | 15K |
| 1536. | UT54ACTS374PCA | RadHard MSI. Octal DFF with 3-state outputs. TTL compatible I/O level. Lead finish solder. | UTMC | Ceramic DIP | 20 | -55°C | 125°C | 15K |
| 1537. | UT54ACTS374PCX | RadHard MSI. Octal DFF with 3-state outputs. TTL compatible I/O level. Lead finish optional. | UTMC | Ceramic DIP | 20 | -55°C | 125°C | 15K |
| 1538. | UT54ACTS374UCA | RadHard MSI. Octal DFF with 3-state outputs. TTL compatible I/O level. Lead finish solder. | UTMC | Ceramic flatpack | 20 | -55°C | 125°C | 15K |
| 1539. | UT54ACTS374UCC | RadHard MSI. Octal DFF with 3-state outputs. TTL compatible I/O level. Lead finish gold. | UTMC | Ceramic flatpack | 20 | -55°C | 125°C | 15K |
| 1540. | UT54ACTS374UCX | RadHard MSI. Octal DFF with 3-state outputs. TTL compatible I/O level. Lead finish optional. | UTMC | Ceramic flatpack | 20 | -55°C | 125°C | 15K |
