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Found: 204      Displaying: 121 - 140
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
121.
UT22VP10T-20UPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
FlatPack
24
-
-
287K
122.
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
123.
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
124.
UT22VP10T-20WPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
125.
UT22VP10T-20WPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
126.
UT22VP10T-20WPXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
127.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
128.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
129.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
130.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
131.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
132.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
133.
UT22VP10T-25PPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
134.
UT22VP10T-25UPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
FlatPack
24
-
-
287K
135.
UT22VP10T-25UPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
FlatPack
24
-
-
287K
136.
UT22VP10T-25WPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
137.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
138.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
139.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
140.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
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