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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 81. | UT22VP10E-20PCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 82. | UT22VP10E-20PCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 83. | UT22VP10E-20PCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 84. | UT22VP10E-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 85. | UT22VP10E-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 86. | UT22VP10E-25PCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 87. | UT22VP10E-25PCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 88. | UT22VP10E-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 89. | UT22VP10E-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 90. | UT22VP10E-25UCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 91. | UT22VP10E-25UCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 92. | UT22VP10E-25UCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 93. | UT22VP10E-25UCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 94. | UT22VP10E-25WCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 95. | UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 96. | UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 97. | UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 98. | UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 99. | UT22VP10T-15WCC | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 100. | UT22VP10T-15WCX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
