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Found: 1409      Displaying: 1381 - 1400
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1381.
5962H9475408QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1382.
5962H9475408QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1383.
5962H9475408QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1384.
5962H9475408QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1385.
5962H9475408QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1386.
5962H9475408QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1387.
5962H9475408QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1388.
5962H9475408QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1389.
5962H9475408QYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1390.
5962H9475408QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1391.
5962H9475408QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1392.
5962H9475408VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1393.
5962H9475408VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1394.
5962H9475408VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1395.
5962H9475408VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1396.
5962H9475408VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1397.
5962H9475408VYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1398.
5962H9475408VYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1399.
5962H9563801QQCRadiaton-Hardened 8-bit microcontroller: SMD. Total dose 1E6 rads(Si). Class Q. Lead finish gold.
UTMC
DIP
40
-55°C
125°C
137K
1400.
5962H9563801QQXRadiaton-Hardened 8-bit microcontroller: SMD. Total dose 1E6 rads(Si). Class Q. Lead finish optional.
UTMC
DIP
40
-55°C
125°C
137K
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