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Found: 1409      Displaying: 1341 - 1360
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1341.
5962H9475406QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1342.
5962H9475406QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1343.
5962H9475406QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1344.
5962H9475406QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1345.
5962H9475406QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1346.
5962H9475406QYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1347.
5962H9475406QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1348.
5962H9475406QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1349.
5962H9475406VLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1350.
5962H9475406VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1351.
5962H9475406VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1352.
5962H9475406VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1353.
5962H9475406VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1354.
5962H9475406VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1355.
5962H9475406VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1356.
5962H9475406VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1357.
5962H9475406VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1358.
5962H9475406VYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1359.
5962H9475406VYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1360.
5962H9475407QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1361.
5962H9475407QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
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