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Found: 1409      Displaying: 1301 - 1320
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1301.
5962H9475404QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1302.
5962H9475404QLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1303.
5962H9475404QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1304.
5962H9475404QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1305.
5962H9475404QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1306.
5962H9475404QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1307.
5962H9475404QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1308.
5962H9475404QYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1309.
5962H9475404QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1310.
5962H9475404QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1311.
5962H9475404QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1312.
5962H9475404VLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1313.
5962H9475404VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1314.
5962H9475404VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1315.
5962H9475404VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1316.
5962H9475404VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1317.
5962H9475404VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1318.
5962H9475404VYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1319.
5962H9475405QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
1320.
5962H9475405QLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
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