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Found: 390      Displaying: 261 - 280
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
261.
5962F9475402QLARadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
262.
5962F9475402QLXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
263.
5962F9475402QLXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
264.
5962F9475402QXCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
265.
5962F9475402QXCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
266.
5962F9475402QXXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
267.
5962F9475402QYARadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
268.
5962F9475402QYCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
269.
5962F9475402QYXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
270.
5962F9475402VYARadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
271.
5962F9475402VYCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
272.
5962F9475402VYCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
273.
5962F9475403QLCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
274.
5962F9475403QLCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
275.
5962F9475403QXARadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish soldr.
UTMC
FlatPack
24
-55°C
125°C
287K
276.
5962F9475403QXCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
277.
5962F9475403QXXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
278.
5962F9475403QYARadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
279.
5962F9475403QYARadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
280.
5962F9475403QYCRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
281.
5962F9475403QYXRadiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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