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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 41. | UT22VP10C-25WCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 42. | UT22VP10C-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 43. | UT22VP10C-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 44. | UT22VP10C-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 45. | UT22VP10C-25WPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 46. | UT22VP10C-25WPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 47. | UT22VP10E-25WCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 48. | UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 49. | UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 50. | UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 51. | UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 52. | UT22VP10E-25WPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 53. | UT22VP10E-25WPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 54. | UT22VP10T-25WCC | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 55. | UT22VP10T-25WCX | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 56. | UT22VP10T-25WPA | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 57. | UT22VP10T-25WPC | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 58. | UT22VP10T-25WPC | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 59. | UT22VP10T-25WPX | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 60. | UT22VP10T-25WPX | Radiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
